晶圓減薄（晶圓拋光）GDM300_Hapoin衡鵬
晶圓減薄（晶圓拋光）GDM300特長：
·The process from back grinding to wafer mounting continuously by fully automatic system, Which enable to grind till 25um thickness.
·With 2 head polishing stage, throughput is almost double compared with 1 polish head system.
·Built in edge trimming system is available as an option for thin wafer process.
·Dual index system, which polishing stage and grinding stage is completely separated, satisfy the cleanness required for TSV and MEMS process.
·Less than Ra1A ultra luminance, ultra mirror surface is possible.
采用全自動系統，從后磨到貼裝的連續過程，可研磨至25um厚度。
2個磨頭階段，產量幾乎是1個磨頭系統的兩倍。
內置修邊系統可作為薄型晶圓加工的選擇。
雙指標體系，拋光階段和研磨階段完全分離，滿足TSV和MEMS工藝所需的清潔。
超亮度小于Ra1A，可超鏡面。
了解更多：http://www.hapoin.com/Wafer_Grinding/
晶圓減薄（晶圓拋光）GDM300相關產品：
Hapoin衡鵬供應
晶圓研磨/晶圓減薄/晶圓拋光/晶圓背拋/Wafer Grinding GNX200BP
