SnBi合金_低溫焊接底填膠_39-ICH09/39-ICH08
SnBi合金低溫焊接底填膠39-ICH08/39-ICH09_適用于低溫焊接封裝。該膠水為平衡固化劑。有可能獲得低CTE和低溫度固化的特性。
ASEC低溫焊接底填膠39-ICH09功能：
用于散熱器包裝
·該Underfill膠水兼顧了流動性和散熱性能。2.2瓦/米/千
·低CTE提供良好的熱沖擊性能
ASEC_SnBi合金低溫焊接專用底填膠39-ICH08特點：
Liquid state
Property Typical Value Test Condition
Chemical Epoxy (Black)
Specific Gravity 1.4 @25度
Thixotropic index 1.0 12s-1/120s-1
Viscosity 4.200 mPa·s Cone plate type, 120s-1
Cured state
Property Typical Value Test Condition
Tensile Modulus 4.6 Gpa 25度, DMA
Tg 120度 DMS
CTE α1/α2 39/105 ppm/度 TMA
Tensile shear strength 16 Mpa JIS K 6850
Volume resistivity 2.28 x 1015Ω·cm JIS K 6911
Surface resistivity 9.7 x 1015Ω JIS K 6911
Dielectric constant 3.08 1.0GHz
3.05 2.45GHz
Dielectric loss tangent 0.015 1.0GHz
0.015 2.45GHz
ASEC 39-ICH09低溫焊接底填膠特點：
Liquid state
Property Typical Value Test Condition
Chemical Epoxy
Viscosity 29,500 mPa·s @25degC B type Viscometer
Filler Size 10μm Maximum size
Flowability 10mm GAP50μm Glass/Glass 100x60sec
Cured state
Property Typical Value Test Condition
Storage Modulus 18 Gpa 25度
Tg 110度
CTE α1/α2 15/58 ppm/度
Moisture Absorption 0.5% PCT 2atm, 20hr
Thermal conductivity 2.2 W/m/K
衡鵬供應
